Oxygen Free Copper

World’s largest scale production and quality by the birth of the top of oxygen free Cu “class 1”

SH Copper Products, since the success to become the pioneers in the mass production of oxygen free Cu in our country,Cu strip, cu bars and rods, machined parts has been produced under integration. Presently, largest scale production of oxygen free Cu has been achieved. By reaching to the extreme level in high quality oxygen free copper production technologies, Oxygen free Cu for electron tube, class 1~5 specified in US standard ASTM F68, the highest grade Class 1has been developed.
This product, especially with superior gas discharge properties in ultra high vacuum, it is evaluated highly by our domestic customers as well as internationally.

Integrated Production and process control for high quality

, by the uniquely developed vacuum degassing facility in the continuous casting line, gas in the Cu has been lowered to the limits, which has made it possible for us to mass produce oxygen free Cu class 1. Based on this technology, integrated production from slab to product and stringent process control, stable supply of high grade oxygen free Cu can be delivered to our customers.

No competitors to be overwhelmed by cryogenic OFC and high quality Cu alloy development

Besides the class 1, by taking advantage of the high purity of oxygen free Cu, Cu alloys with based on their applications with Zr,Ag,Tin and additional trace elements, in the field of super conductivity, needs were met by developing oxygen free Cu(Cryogenic OFC) to have less than half of electrical resistivity in extremely low temperature.
By overwhelming the competitors supported by our unique advanced technologies, oxygen free Cu, starting with ultra high vacuum facilities, semiconductor, super conductors having great effects to the leading edge technology field.

High purity, high ductility, high thermal conductivity…
they are the advantages that can only be attained in OFC and not from deoxidized Cu nor tough pitch Cu

Comparison on Properties of Various types of Cu
Designation OFC
(OFC)
P-Deoxidized Cu
(P-DCu)
Tough Pitch Cu
(TPC)
JIS No. C1011 C1020 C1220 C1100
Chemical Composition
Specification
Cu*1 >99.99% >99.96% >99.90% >99.90%
O2 <10ppm No Spec No Spec
(In-house Measurement 3ppm) (approx, 50ppm) (400ppm程度)
P <3ppm No Spec 0.015〜0.040% No Spec
Specific Gravity
(g/㎤)
casted 8.90 8.90 8.4〜8.6
fabricated 8.94 8.94 8.89〜8.94
Degassing at
High Temperature
extremely low discharge of P
in high temperature vacuum
low
Uniformity superior good fair
Electrical Conductivity(%IACS) 102 82 101
Thermal Conductivity(w/m・k) 391 339 381
Anti-Hydrogen
Embrittlement
Superiority Superiority NA
Deep Drawing Superiority Good Fair
Adhesiveness
of Oxide Layer
Superiority NA Good
Heat/Softening
Temperature
Higher High Low

*1:include a silver

Properties of Oxygen Free Cu, Stainless Steel, Al Alloy
Designation Oxygen Free Cu
(C1011)
Stainless Steel
(SUS304)
Al Alloy
(A6063)
Specific Gravity(g/㎤) 8.94 8.03 2.71
Melting Point(℃) 1,083 1,425 630
Electrical Conductivity(%IACS) 102 2 58
Thermal Conductivity(W/m・K) 391 16 201
Elastic Modulus(N/㎟) 118,000 193,000 69,000
Shear Modulus(N/㎟) 44,000 72,000 26,000
Tensile Strength(N/㎟) 220 680 140
Elongation(%) 45 55 25
Bending Fatigue Strength(N/㎟) 162 785 107
CTE(×10-6/℃) 17.0 17.3 23.0

SUS304:Fe+18%Cr+8%Ni
A6063:AI+0.7%Mg+0.4%Si

Standards on Oxygen Free Cu of respective countries
Material Standard Country Japan USA Great Britain Germany
No. JISH2123 ASTMB170 BS6017 DINI787
Designation OFC Oxygen-free
Electrolytic
Copper Refinery
Shapes
Oxygen-free
Refined Copper
Oxygen-free
Copper without
deoxidizer
Code Grade 1
C1011
Grade 2
C1020
Grade 1
C10100
Grade 2
C10200
Cu-OFE
C103
Cu-OF
C110
OF-Cu
2.0040
Chemical Cu*2
(%)
99.99
min
99.96
min
99.99
min
99.95
min
99.99
min
99.95
min
99.95
min
O2
P
(ppm)
10max
3max
10max
No Spec
5max
3max
10max
No Spec
10max
3max
No Spec No Spec
Other related Cu Product Standards JIS
H3510
Oxygen Free Cu for Electron Tube
Plate
Strio
Bar
Wire
Tube
JIS
H3100
3140
3250
3300
Cu and CuAlloys for Strips
Bus BArs
Bars and Tubes
ASTM
F68
Oxygen Free Cu for
Electron Devices
(Class1~
Class5)
ASTM
B75
B152
B248
Tube
Plate
Strip
Bar
BS2870~2875
Cu and CuAlloys for Strips
Tube
Plate
Strip
Bar
DIN40500-Part 4
Cu for Electrical Application

SH Copper Products conforms to all above standards.
*2:include a silver

High Purity oxygen free copper class1and cryogenic oxygen free copper, oxygen copper meeting the needs

Classification Designation CDA No. Chemical Composition
[wt%]
Electrical Conductivity
[%IACS]
Heat Softening Temp
[℃]
Characteristics Main Application
Oxygen Free Cu Oxygen Free Cu
Class 1
C1011-C1
(class)
[C10100, ASTM F68,Class 1]
Cu:>99.99 101 200 minimal gas discharge
sound crystal structure
Particle Accelerators
Transmitting Tube
Electron Tube
Waveguide
Target Material
Cryogenic
OFC
CG-OFC
[C10100]
Cu:>99.99 101 200 minimal electrical resistivity
at extremely low temperature
stabilizers for Superconducting wire
OFC
Grade1
(OFC for electron tube)
C1011
[C10100]
Cu:>99.99 101 200 High electrical conductivity
Superior welding, forming properties
Superior in adhesion of oxide layer
vacuum value, transmitting tube
Magnetron, Target Material
OFC
Grade2
(General purpose)
C1020
[C10200]
Cu:>99.96 100 200 High electrical conductivity
Superior welding, forming properties
conductor of communication cable
Heat sink for electronic device
many others
Zr bearing low Zr OFC HCL®-02Z
[C15150]
Cu+Zr:>99.96
Zr:0.015~0.030
97 450 Heat softening resistance is at highest level
Good for Direct wire bonding
Good adhesiveness to resin
lead frame for semiconductor
Zr OFC C151
[C15100]
Cu+Zr:>99.96
Zr:0.05~0.15
94 500
Hi Zr OFC C150
[C15000]
Cu+Zr:>99.96
Zr:0.10~0.20
92 500 Heat softening resistance is at highest level
superior fatigue properties
Electrode chips
Sn bearing Sn OFC HCL®-12S
[C14415]
Cu+Sn:>99.96
Sn:0.10~0.15
90 350 moderate electrical conductivity
and heat softening resistance
lead frame for semiconductor
radiator fins
Ag bearing low AgOFC 3Ag-OFC
[C10400]
Cu+Ag:>99.96
Ag:0.027~0.034
97 350 High electrical conductivity
Superior heat softening resistance and abrasion proof properties
commutator bar
Ag OFC 8Ag-OFC
[C10700]
Cu+Ag:>99.96
Ag:0.085~0.102
97 360
Hi AgOFC 20Ag-OFC
[-]
Cu+Ag:>99.96
Ag:0.15~0.25
97 360

Chemical composition accord with specifications.
electrical conductivity and heat softening temperature are typical values(depends on temper)

Field of advanced technology to industrial field, suitable for variety of needs
Typical application of Oxygen free copper

Material Suited for Requirements based on Different Applications
Application Electrical Conductivity Thermal Conductivity Strength Ductility Gas Discharge Heat Softening Resistance Anti-Hydrogen Embrittlement Anti-corrosion Jointing Properties Adhesiveness of oxide layer abrasion proof suited material
Electron Tube for Particle Accelerators C1011-C1
(class 1)
C1011
Vacuum Parts
magnetron, valves, waveguides
C1011
Stabilizers for Superconducting Wire CG-OFC
C1011
Semiconductor Lead frame C151
HCL®-02Z
HCL®-12S
Bus Bar, Flexible Bus Duct C1020
commutator bar Ag-OFC
Coiled Material
generators, induction Furnace, transformers
C1020
Trolley Bar Ag-OFC
connector
contact terminals, sleeve
C1020
communication cables C1020
cables for audio facility
[LC-OFC]
C1011-C1
(class 1)
C1011
electrode for welding C150
Target material C1011-C1
(class 1)
C1011

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