Cu Strip for Lead Frame

 

Theme is supplying material to Customer needs

銅合金条

SH Copper Product’s theme is “Material Application Just Fit for Customer’s Use”.

To meet today’s incessantly changing and diversifying needs, based on the theme “Material Application Just Fit for Customer’s Use”, by uniting our wide line-up of copper and copper alloys to our metal fabrication technologies, such as dual gauge processing and foil fabrication, we support the evolution of the electronic industry.

At SH Copper Products, for Cu Strips for semiconductor lead frame, oxygen free Cu based alloys are available for discrete, transistor and IC’s and unique high strength, high electrical conductivity alloys are made available for high pin count LSI.

Cu Alloy strips to back up the electronic technology

Cu Alloys of SH Copper Products

shカッパープロダクツの銅合金

Cu alloy for semiconductor lead frame, from discrete to LSI

リードフレーム用銅合金条

C1020

C1020

Outline

By the recent high integration of IC chips, the heat emission has increased and in order to suppress the temperature, packages with heat sink are becoming more and more. For heat sink, material with the highest thermal conductivity, oxygen free copper is usually selected. SH Copper is the world’s largest oxygen free copper manufacturer and supply oxygen free copper strip for heat sink all globally.
Compared to tough pitch copper, it is superior in thermal conductivity, electrical conductivity and formability, being the standard material widely used for heat sink application.

Characteristic

(1)High quality, High Purity oxygen free copper(C10200) is applied.
(2)Ultra high purity oxygen free copper(C10100, Cu above 99.99%) strip is also available.

Standard Size

Thickness: 0.1 to 3.0mm
Width: max.550mm

Chemical composition(wt%)
Cu
99.96min
physical properties
Coefficient of thermal expansion(10-6/K) 17.7
Specific gravity(g/㎤) 8.94
Volume resistivity(μΩ・m) 0.0171
Longitudinal elastic modulus(N/㎟) 118000
Thermal conductivity(W/m・K) 391
Conductivity(%IACS) 97min
Mechanical characteristic
Temper O 1/4H 1/2H H
Tensile strength(N/㎟) 195min 215〜275 245〜315 275min
stretching(%) 35min 25min 15min 2min
Hardness(MHv) 45〜75 60〜90 75〜105 95〜125

HCL-12S

HCL-12S

Outline

HCL-12S is a copper alloy for lead frame material for small signal transistor and power transistor used widely, worldwide.
By adding small amount of tin to our high purity oxygen free copper, HCL-12S retains the softening resistance as a lead frame material keeping the superior properties of oxygen free copper having good cost performance. It is used also for widely in the field of contacts in circuitry, such as relay, switches.

Characteristics

(1)By the small additive of Tin, HCL-12S retains marginable softening resistance from heat.
(2)HCL-12S having the superior electrical conductivity, adhesiveness of surface oxides of oxygen free copper is also a good cost performance material.

Chemical composition(wt%)
Cu+Sn Sn
99.96min 0.10〜0.15
physical properties
Coefficient of thermal expansion(10-6/K) 17.7
Specific gravity(g/㎤) 8.90
Volume resistivity(μΩ・m) 0.019
Longitudinal elastic modulus(N/㎟) 118000
Thermal conductivity(W/m・K) 360
Conductivity(%IACS) 85min
Mechanical characteristic
Temper 1/2H H
Tensile strength(N/㎟) 275〜360 315min
stretching(%) 6min 2min
Hardness(MHv) 85〜110 100〜130

HCL-02Z

HCL-02Z

Outline

HCL-02Z is not only used for discrete packages for small signal transistors or power transistors but also used for IC’s, TBGA stiffeners based with superior properties, used for various types of lead frames. HCL-02Z, by adding Zr to high purity oxygen free Cu, it incorporates high heat/softening resistance, thus taking advantage of superior properties of oxygen free copper, it is attracting great attention as a non-plated lead frame material. It is used also for widely in the field of contacts in circuitry, such as relay, switches.

Characteristics

(1)HCL-02Z has high heat/softening resistivity by the small addition of Zr.
(2)HCL-02Z retains superior properties of oxide adhesiveness, resin adhesiveness, direct wire bond-ability and plate-ability of oxygen free copper.
(3)It is also used widely for TBGA stiffeners and power QFN.

Chemical composition(wt%)
Cu+Zr Zr
99.96min 0.015〜0.03
physical properties
Coefficient of thermal expansion(10-6/K) 17.7
Specific gravity(g/㎤) 8.90
Volume resistivity(μΩ・m) 0.018
Longitudinal elastic modulus(N/㎟) 121000
Thermal conductivity(W/m・K) 373
Conductivity(%IACS) 94min
Mechanical characteristic
Temper 1/2H H SH
Tensile strength(N/㎟) 275〜360 315min 400min
stretching(%) 6min 2min 2min
Hardness(MHv) 85〜110 100〜130 125〜145
Resin adhesion test

Resin adhesion test

Direct wire bonding test

Direct wire bonding test

Heat resistance of the C151, HCL-02Z

Heat resistance of the C151, HCL-02Z

C151

C151

Outline

C151 is a standard material for PLCC packages equivalent to CDA15100 and one of the favorite Cu alloys in SH Copper Products. For the high heating softening resistivity and superior surface treatment properties, recently, it is gaining attention for the use in TBGA stiffeners, as same as HCL-02Z.

Characteristics

(1)C151-3/4H is supplied to worldwide users for PLCC lead frame material.
(2)C151-SH is an unique material having high strength, high electrical conductivity and characteristics of oxygen free copper.

Chemical composition(wt%)
Cu+Zr Zr Mn Al
99.96min 0.05〜0.15 0.005max 0.005max
physical properties
Coefficient of thermal expansion(10-6/K) 17.7
Specific gravity(g/㎤) 8.90
Volume resistivity(μΩ・m) 0.018
Longitudinal elastic modulus(N/㎟) 121000
Thermal conductivity(W/m・K) 360
Conductivity(%IACS) 90min
Mechanical characteristic
Temper 3/4H H SH ESH
Tensile strength(N/㎟) 320〜385 365〜430 400min 425〜485
stretching(%) 5min 4min 2min
Hardness(MHv) 100〜125 115〜135 125〜150
Heat resistance of the C151, HCL-02Z

Heat resistance of the C151, HCL-02Z

C194

C194

Outline

C194(CDA19400) is a copper alloy which has high strength with superior stamping properties and is applied to IC lead frames and connectors all over the world. With better plating properties, etching properties and stamping properties, it is evaluated highly among the customers.

Characteristics

(1)Our C194 has finer precipitates good for better plating and etching properties.
(2)Our C194 has higher heat/softening resistance and offers much higher stamping efficiency.

Chemical composition(wt%)
Fe Zn P Cu
2.1〜2.6 0.05〜0.20 0.015〜0.15 97min
physical properties
Coefficient of thermal expansion(10-6/K) 17.7
Specific gravity(g/㎤) 8.8
Volume resistivity(μΩ・m) 0.025
Longitudinal elastic modulus(N/㎟) 123000
Thermal conductivity(W/m・K) 230min
Conductivity(%IACS) 60min
Mechanical characteristic
Temper 1/2H H SH ESH
Tensile strength(N/㎟) 365〜435 415〜485 480〜525 520〜590
stretching(%) 5min 2min 4min 5min
Hardness(MHv) 115〜137 125〜145 140〜155 150〜170
Temper:H、ESHの耐熱性

Temper:H、ESHの耐熱性

HCL-305-1/2H(for lead frame)

HCL-305-1/2H

Outline

HCL-305 is a precipitation hardening Corson type alloy, well suited for tiny SOT packages for mini mold transistors used in recent mobile devices.

Characteristics

(1)HCL-305 has strength comparable to alloy 42 with elongation over 10%, which can endure the severe lead forming of tiny SOT packages.
(2)By adding Zn, high adhesiveness to resin is achieved, offering much better reliability.

Chemical composition(wt%)
Ni Si Zn P Cu
2.2〜2.8 0.3〜0.7 1.5〜2.0 0.015〜0.06
physical properties
Coefficient of thermal expansion(10-6/K) 17.4
Specific gravity(g/㎤) 8.9
Volume resistivity(μΩ・m) 0.0410
Longitudinal elastic modulus(N/㎟) 116000
Thermal conductivity(W/m・K) 110
Conductivity(%IACS) 25min
Mechanical characteristic
Temper 1/2H
Tensile strength(N/㎟) 500〜650
stretching(%) 8min
Hardness(MHv) 160〜210
Resin adhesion test

Resin adhesion test

HCL-64T

HCL-64T

Outline

HCL-64T is a Cu Alloy which has been licensed by Furukawa Electric Co., and fabricated and marketed by SH Copper Products and standardized as CDA18045. This alloy has high strength and high electrical conductivity used for variety of packages such as QFP, SOP and mini mold transistors.

Characteristics

This Cu alloy having both high strength and electrical conductivity is well balanced and suited for thin, high pin count QFP and SOP lead frames. It also has superior properties required in manufacturing of lead frames and IC assembly.

Chemical composition(wt%)
Cr Sn Zn Cu
0.20〜0.30 0.23〜0.27 0.18〜0.26
physical properties
Coefficient of thermal expansion(10-6/K) 17.0
Specific gravity(g/㎤) 8.90
Volume resistivity(μΩ・m) 0.023
Longitudinal elastic modulus(N/㎟) 127000
Thermal conductivity(W/m・K) 301
Conductivity(%IACS) 71min
Mechanical characteristic
Temper 1/2H
Tensile strength(N/㎟) 490〜588
stretching(%) 10min
Hardness(MHv) 160〜195

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